CIPS - International Conference on Integrated Power Electronics Systems

🗓️10/03/2026-12/03/2026

📍Germany

The CIPS - International Conference on Integrated Power Electronics Systems is set to take place in Dresden, Germany, at The Westin Bellevue. The Conference is organized by the VDE (ITG) and will focus on the advancements in power electronic systems driven by the need for energy-saving technologies, intelligent energy management, enhanced power quality, system miniaturization, and high reliability. The Conference highlights the significance of monolithic and hybrid system integration, featuring advanced device concepts such as wide bandgap devices and innovative packaging technologies. Participants can expect in-depth discussions on the integration of hybrid systems and mechatronic systems that offer high power density, along with the operational behavior, reliability, and availability of systems and components.CIPS 2026 will continue the legacy of its predecessors, emphasizing the increasing functionality, energy efficiency, and reliability of power electronics while simultaneously working towards reducing costs. The Conference will feature interdisciplinary invited papers that present fundamental technologies for integrated power electronic systems, as well as emerging applications that are poised to impact the industry. Esteemed speakers such as Thomas Harder and Leo Lorenz from ECPE, along with Nando Kaminski from the University of Bremen and Andreas Lindemann from Otto-von-Guericke-University Magdeburg, will be sharing their insights. Additionally, the event will include an exhibition that has received positive feedback from previous Conference delegates, providing a platform for showcasing cutting-edge technologies and solutions in the field. The Conference proceedings will be published by the VDE Publishing House and made available on IEEE Xplore, ensuring that the valuable knowledge shared at the event reaches a wider audience.

🏷️ Energy Saving Systems; Intelligent Energy Management; Power Quality; System Miniaturisation; High Reliability; Monolithic and Hybrid System Integration

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